BAE Systems Principal Electrical Engineer - Packaging in Merrimack, New Hampshire
BAE Systems - FAST Labs is seeking an engineer specializing in packaging of printed circuit boards for RF applications including high speed materials. Needs a strong background in RF circuit testing including network analysis, dynamic range, noise figure, phase noise, compression and intercept points along with in-depth knowledge of integrated circuit packaging and integration. Also required is a good working knowledge of programming related to test automation and data processing (MATLAB and/or Python).
Candidate must have a good intuitive understanding of EM behavior and should understand how circuit layout drives analog/RF/microwave performance. The designer is expected to take his/her circuits through all phases of design, simulation, layout, verification, and test. A mathematical and intuitive understanding of transistor-level RF circuit design is beneficial.
The candidate must have good people skills and be able to work with limited supervision as part of a team or in a lead role. The ability to exercise discretion and independent judgment in technical areas is also important.
Typical Education & Experience
Bachelor's Degree and 12 years work experience or equivalent experience
Required Skills and Education
Bachelor's degree in an Engineering or Scientific field (or equivalent experience)
U.S. Citizenship required and ability to obtain Secret security clearance
Background in EM, mixed signal technologies, analog, RF/Microwave
Tool experience with MATLAB, SPICE
Experience with CAD tools: Altium, Agilent (Keysight) ADS, ANSYS HFSS, AWR Microwave Office, Cadence IC Suite or Allegro PCB Design
Working level understanding of C , Python, GPIB script and GIT Version control
Experience with electrical design
Testing experience with Analog, RF, Microwave, and/or digital circuits
Strong written and oral communication skills (including Microsoft Office)
Familiarity with Linux shell environment Familiarity with lab equipment: Network Analyzers, Spectrum Analyzers, Noise Figure Analyzers, Oscilloscopes, signal generators, etc.
Preferred Skills and Education
RF/Microwave and mixed-signal packaging experience
Experience in RFIC/mixed-signal/ IC development
microwave and millimeter wave design
Automated testing experience (Matlab, GPIB, Labview etc)
Linux scripting to automate design tasks
About BAE Systems Electronic Systems
BAE Systems is a premier global defense and security company with approximately 100,000 employees delivering a full range of products and services for air, land and naval forces, as well as advanced electronics, security, information technology solutions and customer support and services.
Electronic Solutions, based in Nashua, New Hampshire, provides systems and products that maximize the effectiveness and safety of fighting forces and first responders. Its offerings include infrared countermeasures and electronic protection systems for military and civilian aircraft; information management systems; signal acquisition, analysis, and exploitation systems that optimize use of the electromagnetic spectrum by friendly forces while denying its use by adversaries; interoperable communications systems for firefighters and other first responders; thermal weapon sights; precision targeting systems; situational awareness systems for ground vehicles; night-vision systems; identification friend or foe systems; and radiation-hardened electronics. Electronic Solutions also includes the group s Technology Solutions unit, which joins the business with government research organizations and industry to develop and demonstrate innovative system concepts in such areas as situational awareness, communications and networking, and precision targeting.
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Principal Electrical Engineer - Packaging
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